AT&S demonstrated efficiency and robustness of Embedded Power technology
(World News Austria)

Electromobility and industrial applications benefit from higher power density, improved switching performance and thermal robustness Leoben, 05 April 2019 - To improve the efficiency in modern cars on the way to electromobility and in challenging industrial power conversion applications the power density has to be increased without limitations on performance and reliability. Based on the AT&S ECP® (Embedded Components Packaging) technology active and passive components have been integrated into PCBs for low-power designs and are used in volume production meeting high-quality requirements. Against this background the implementation of power semiconductors like MOSFETs or diodes directly into...