Shape affects performance of micropillars in heat transfer
(PHYSorg.com Physics)

As our electronic devices get more sophisticated, they also generate more heat that must be released for maximum performance. Damena Agonafer, a mechanical engineer and materials scientist in the McKelvey School of Engineering at Washington University in St. Louis, is perfecting a way to dissipate the heat through a unique process involving tiny liquid drops on top of an array of micropillars.