AT&S presented advanced PCB and packaging technology at 15th Technology Forum
(World News Austria)

Experts discussed innovative solutions for continued miniaturization, higher power densities, high-speed communication (5G) and electromobility At the Red Bull Ring, where high-performance racing cars usually run laps, AT&S presented current trends, challenges and solutions for PCBs and connectivity solutions at the 15th Technology Forum. The choice of venue at the Formula 1 racing circuit highlighted many parallels between the two fields - success in both depends on maximum speed, high efficiency, reliability and innovative cutting-edge technology. Numerous international customers and partners found out about the latest developments in the electronics and PCB industry for areas such as...