We are getting close to the largest annual mobile technology show, the Mobile World Congress in Barcelona, and one of the manufacturers expected to launch a new flagship device has already spilled some of its beans.
Xiaomi Seniro VP Xiang Wang shared a bunch of press renders of the upcoming Xiaomi Mi 9, showing the triple-camera on the rear of the device in all its glory. The main module will feature a 48MP sensor and the Mi 9 is likely one of the first handsets to be powered by Qualcomm`s latest top-end chipset Snapdragon 855.
#Mi9 is here! We used nano-level laser engraving holographic technology + dual layer nano coating to create this beautiful and unique color.For more details, make sure you check out our new product launch on Feb 24! pic.twitter.com/vtBLCJTBQD
- Wang Xiang (@XiangW_) February 14, 2019
Meanwhile another Xiaomi executive, co-founder and director of the Chinese division Chuan Wang posted a few full-size camera samples on his Weibo profile. A low-light shot of some plastic flower, and indoor shot of an aquarium and an outdoor image of three golden labradors all show good color and dynamic range. When zooming in to a 100% view there is a lot of fine detail but also some of the smearing of fine textures that is typical for many smartphone cameras.
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The Xiaomi Mi 9 will be officially launched on February 24. Full specifications and other information about the triple-camera will be available then.
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